Our market segment is dedicated to providing innovative solutions and supporting the assembly of the next generation of semiconductor devices.
Thick & thin film.
Polymeric glass & wafers.
Flip-chip bonder.
Epoxy die attached.
Laser bar stacker/ unstacker.
Laser for resistor trimming.
Laser for cutting & drilling.
Vacuum reflow solder system
Void free fluxless soldering
Implantation/ contact annealing
RTP - RTA - RTO - RTN
Fine Line thick film solution.
Optoelectronic dry process dicing. Nanotechnologies and more...
One bond head multiple processes
Wedge, Ball, Ribbon bonding