VACUUM REFLOW SYSTEMS

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UniTemp provides advanced thermal processing solutions, such as a vacuum and vacuum/pressure flux-less soldering system that operates with up to four gas lines, ensuring void-free joints.

VSS-300
Cutting Edge Void Free Fluxless Soldering

The VSS-450-300 vacuum / pressure reflow solder system is an ideal solution for soldering processes involving wafer diameters up to 12'' or substrate sizes up to 12'' x 12'', with a maximum temperature of 450℃.

VSS-300
Vacuum / Pressure Oven

Vacuum /pressure reflow oven VSS-450-300

VSS-300: Max 450℃ / Opt 650℃
VSS-300-HV: Vacuum up to 10E-6 hPa
VSS-300-OP: Over Pressure up to 2.5k hPa

Features

Excellent temperature uniformity
Active void reduction < 1%
UP to 4 gas lines (MFC)
Heated by Infrared Lamps
Maximum temperature is 450℃
Fast ramp up  120 K/min
Fast ramp-down 80 K/min
Integrated data logging
Small foot print

Applications

Solder Reflow with and without flux
Wafer bump and solder ball reflow
Flip Chip
Encapsulation and sealing of housings
High Power LED module
Resistor paste firing
IGBT/DBC
Die attached
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RSS series
Powerful Table Top Void Free Fluxless Soldering

The Reflow Solder System (RSS) series is a compact and easy-to-use tool designed for use in laboratories and clean rooms as a tabletop unit. The chamber is vacuum-sealed and equipped with a viewing window, allowing for monitoring of the soldering process. The unit comes standard with a Mass Flow Controller for the process gas.
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RSS series
Vacuum Oven

Vacuum reflow soldering system

RSS-110: 4''x4'' / Max 400℃
RSS-160: 6''x6'' / Max 400℃
RSS-210: 8''x8'' / Max 400℃ / Opt 500℃

Features

Excellent temperature uniformity
Active void reduction < 1%
Programmable temperature profiles
Data Monitoring read-out and analysis temperature
Process gas flow, up to 4 lines
cooling water level status
Pressure value and status
Maximum temperature is 400℃
Fast ramp up  120 K/min
Fast ramp-down 120 K/min
Small foot print

Applications

Fluxless soldering
Operating with Inert gas, Oxygen gas, Hydrogen gas, Forming gas, Formic Acid
Lead free and void free soldering Flip-Chip process
Adhesive bonding
Solder bump reflowing
Hermetic sealing etc...
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High Temperature Reflow
Void Free Fluxless Soldering

The RSO series Reflow Solder System is a versatile tool for various solder applications, capable of reaching temperatures up to 600°C and accommodating large substrates up to 200mm x 170mm in size.
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RSO series
Vacuum Oven

High temperature reflow system RSO equipment

RSO-200: 8''x7'' / Max 650℃
RSO-200-HV: Vacuum up to 10E-6 hPa

Features

Excellent temperature uniformity
Active void reduction < 1%
Data Monitoring read-out and analysis temperature
Process gas flow, up to 4 gas lines
Pressure value and status
Maximum temperature is 650℃
Fast ramp up  10 K/sec
Fast ramp-down 200 K/min
Small foot print

Applications

Fluxless soldering
Operating with Inert gas, Oxygen gas, Hydrogen gas, Forming gas, Formic Acid
Laboratory furnace for implementing new processes
Die-attach, Flip-chip, lid-seal, gyroscopes
MEMS packages, IR sensors, solder bumps
Hermetic sealing etc...
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Multi Functionalities
Void Free Flux and Fluxless Soldering

The RVS 210-S  vacuum reflow solder system  for flux and fluxless soldering is designed for parts up to 200mm x 200mm and 50mm height.
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RVS 210
Vacuum Oven

Flexless vacuum reflow oven

RVS-210: 8''x8'' / Max 300℃

Features

Precise ramp up and fast ramp down
Up to 3 internal process gas lines
Hot plate heated by Infrared lamps and cooled with water
Data Monitoring read-out and analysis temperature
Maximum temperature is 300℃
Fast ramp up  120 K/min
Fast ramp-down 120 K/min
Small foot print

Applications

Reflow solder processes with or without flux
Operating with Inert gas, Oxygen gas, Hydrogen gas, Forming gas, Formic Acid
Laboratory furnace for implementing new processes
Die-attach, Flip-chip, lid-seal, solder bumps
Hermetic sealing etc...

HP Series
High Precision Hot Plates with Integrated Controller

The HP series compact hot plates with integrated precision controller. Reflow of any soldering alloy; Pre-heating for wire bonding; epoxy curing lab test
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HP Series High precision
Hot Plates

HP Series Industrial Hot Plates

From ambient up to 350℃

Features

HP Series

HP-155 / HPP155 / HP220
Integrated controller
250℃ up to 350℃
Part hold by vacuum
Small foot print
Optional lift pins,
Optional cover,
Optional USB port SW for programming on PC

Applications

Reflow of any soldering alloy
Pre-heating for wire bonding
Epoxy curing
Annealing
Curing of photoresists
Lab test
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NPOS Technologies Inc.
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