DRY PROCESS DICING

The JFP Scribe & Break S100-4 is a system designed for scribing and clearing delicate devices.  It is ideal for GaAs MMICS chips, optical sensors, laser bars, and more.

The Scribe S200-8 is a user-friendly tool for separating components up to 8 inches in diameter. It is robust, vibration-free, and immediately operational. Vertical targeting is achieved using a video assembly that includes an electronic crosshair. The S220-8 series provides customers with the best quality and cost-performance ratio available on the market.

The MS-1 manual scribe system is a stable, accurate, fast, and low-cost scribing and cleaving solution suitable for any laboratory. The system features a video interface compatible with Ultra-HD cameras, adjustable digital magnification for increased flexibility, and can handle both small and large chips. The true vertical movement provides high accuracy, allowing for a scribe line of < 10 μm.

The BRK-60R semi-automatic roller breaker is specifically designed for precise and repeatable breaking of small, delicate, sensitive, and hard materials. The operator aligns the breaking lines using the video crosshair, and fine collinearity is necessary to achieve a good break for very small parts. No tilt adjustment is necessary as the floating roller concept automatically compensates for flatness. The system also provides an optional flipping solution to position the broken parts on the user's parabola without the need for adhesive tape.