The WB200 is a new, advanced, semi-automatic wire bonder platform that offers a high degree of flexibility. In addition to standard features such as a deep access 62KHz transducer, multi-height bonding capabilities, and mouse-controlled X-Y-Z motorized axis, the device also has the ability to connect a camera and a tool heater. It is perfect for laboratory, prototyping, and pilot-scale applications. The WB200 is suitable for 17μm up to 50μm - Au, Al & Cu wire, and the Au Stud Bump program is included as standard.
The micro welder is a free-standing, fully automatic system designed for welding metal strips onto a metal base to produce electronic packages. It can weld metal wires and ribbons to a wide variety of surfaces. Gap welding may be the only viable bonding method when electrode access is limited to one part or when the materials used preclude the use of pulsed YAG laser welding.
